High Modulus, Non-Sag, Structural Epoxy Adhesive - 0.5 U.S. GAL PAIL Part A
(2-part system: each kit requires Part A & Part B)
Planibond ® Hi-Mod Gel is a high-modulus, high-strength, moisture-tolerant, low-VOC, two-part, nonsag, structural epoxy adhesive designed for a wide variety of bonding and repair applications.
- 1:1 mixing ratio
- 100%-solids, solvent-free product with low-VOC content
- Nonsag, high-modulus and high-strength
- Moisture-tolerant
- Suitable for use as a pick-proof security sealant
- May be extended with graded sands
- Cures to a light gray color that is similar to concrete color
